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目前来看，高通芯片促使无人机成本下降的推动因素之一是芯片生产的规模化
。高通无人机芯片具有与其智能手机相同的处理器，也可能包括其他一些相同部件
，因而可以享受其芯片规模化生产带来的成本优化效应
。高通芯片促使无人机成本下降的推动因素之二是芯片的高集成化
，这也是最重要的原因。

一、AL8400QSE升降压芯片的性能特点

• 具有200mV电流感应电压和汽车级的线性LED驱动器控制器

• Low Reference Voltage (VFB = 0.2V) 

• -40 to +125°C Temperature Range

• 3% Reference Voltage Tolerance at +25°C

• Low Temperature Drift

• 0.2V to 18V Open-Collector Output

• High Power Supply Rejection: (> 45dB at 300kHz)

• AL8400QSE-7 Automotive Grade qualified to AEC-Q100 Grade 1

• SOT353: Available in “Green” Molding Compound (No Br, Sb)

• Lead-Free Finish; RoHS Compliant

二、PI3USB9201ZTAEX升降压芯片的性能特点

• Dual-Role USB Charging-Type Detector

• Host Mode – SDP/CDP/DCP y USB Device Plug-in and Unplug Detection in SDP/CDP modes

• Support USB Switch Pass-through for Mouse/Keyboard Wake up

• Client Mode USB Charging-type detection y Battery Charging 1.2 SDP/CDP/DCP y Proprietary 1A/2A/2.4A Modes

• Differential Bi-Directional USB Switche

• Wide Bandwidth: 2GHz

• 1MHz I2C Interface for Control and Communication with Pin Selection of up to Four Slave Addresses

• Shutdown Mode of <1µA Current Consumption

• Wide Power Supply Range : 2.7V – 5.5V

• Industrial Temperature Range: -40oC to 85oC

• UQFN 2mm x2mm